Brief: Discover Wanli® TPR-2005AC, a high-quality hot melt adhesive designed for floor mute pad flat lamination bonding. This TPR-based adhesive offers excellent peeling strength, high viscosity, and aging resistance, perfect for woodworking applications. Learn more about its features and applications in this video.
Related Product Features:
TPR-based hot melt adhesive for floor mute pad flat lamination bonding.
High viscosity ensures strong and durable adhesion.
Excellent peeling strength of about 27.0N on stainless steel.
Superior aging resistance for long-lasting performance.
Operates at temperatures between 150℃ to 180℃.
Solid content of 100% for efficient application.
Suitable for standard hot melt adhesive equipment.
Packaged in 20Kg carton boxes for easy handling.
Las preguntas:
What is the peeling strength of TPR-2005AC?
The peeling strength is about 27.0N under 2.5cm*45μm on a stainless steel plate at 180˚.
What is the recommended operating temperature for TPR-2005AC?
The recommended operating temperature is between 150℃ to 180℃, depending on equipment and conditions.
How should TPR-2005AC be stored?
Store in a dry, cool place away from direct sunlight, with temperatures not exceeding 35℃ and away from open flames.